Thin-film over-the-envelope (COF)

COF is a technology that combines Flip Chip Bonding on a Flexible Printed Circuit board (FPC) substrate. That is, the driver IC and its electronic parts can be directly placed on the film (Film), eliminating the traditional printed circuit board and achieving the requirements of lighter, thinner and shorter. This technology uses internal pin bonding, sealing, laser printing, electrical testing and other processes to achieve packaging purposes. It has the characteristics of high density / high pin count, fine pitch, gong bond, high throughput and high reliability. In addition, it has the characteristics of lightweight, thin, short, flexible and reel to reel production, which cannot be achieved by other traditional packaging methods.

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Product details

▎Tape and reel wafer encapsulation COF (Chip on film)

COF is an IC packaging technology, which uses flexible printed circuit film as the carrier of the package chip, and is bonded with the inner lead on the flexible substrate circuit through hot pressing and the gold bump on the river chip.

After the bonding is completed, the electrical connection function between the IC and the flexible substrate is completed, and then the adhesive material is filled with the inner pin joint area through the filler (Under fill). In order to avoid pin breakage, coupled with the low moisture absorption characteristics of electrical insulation, the adhesive can block external moisture and contaminants after baking, protect the entire IC and improve strength, and protect the inside of the IC during reliability testing.

Huaxin Zhenbang has R&D capabilities, continues to develop new technologies and applications, and provides customers with comprehensive needs and services.

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