Chip Probing is to needle test each grain on the wafer, and the probe is equipped with gold wire made of gold wire on the detection head, and the contact (pad) on the grain is in contact to test its electrical characteristics, and the unqualified grain will be marked, and then when the wafer is cut into independent grains according to the grain unit, the unqualified grain marked will be eliminated and no longer proceed to the next process, so as not to increase the manufacturing cost. After wafer fabrication is complete, Chip Probing is a very important step in testing. This step of testing is a transcript of the wafer production process. During the test, the electrical ability and circuit function of each chip are detected. Chip Probing is also known as die sort or wafer sort.