Wafer Bumping
Wafer bumping can provide significant performance, outline dimensions, and overall cost advantages in semiconductor packaging. Extensive experience in numerous alloy mate…
Chip Probing
Chip Probing is to needle test each grain on the wafer, and the probe is equipped with gold wire made of gold wire on the detection head, and the contact (pad) on the gra…
Chip On Glass(COG)
The main purpose of Chip On Glass packaging production line is to divide the wafer into the state of the grain, and the process technology used includes grinding, cutting…
Thin-film over-the-envelope (COF)
COF is a technology that combines Flip Chip Bonding on a Flexible Printed Circuit board (FPC) substrate. That is, the driver IC and its electronic parts can be directly p…
LCM
Reliability Lab (RA Validated)
Huaxin Zhenbang Quality Assurance Laboratory provides environmental reliability experiments such as high and low temperature impact test, accelerated environmental test, …
